3D InCites, LLC: Detailed Corporate Profile

3D InCites, LLC is a specialized media and community platform dedicated to the semiconductor and microelectronics industries, with a primary focus on advanced packaging, 3D integration, and heterogeneous integration technologies. Founded by Fran?oise von Trapp, the entity serves as a central hub for engineers, researchers, manufacturers, and marketers to exchange technical knowledge and track the evolution of "interconnectology"?a term the company popularized to describe the critical role of interconnects in modern chip design.

In early 2026, the 3D InCites platform underwent a significant structural change when it was acquired by the International Microelectronics Assembly and Packaging Society (IMAPS). Under this new stewardship, 3D InCites continues to operate as a premier technical content and media brand within the IMAPS portfolio, maintaining its mission to inform key decision-makers about progress in technology development, standards, and infrastructure.

Core Activities and Industry Role

3D InCites operates at the intersection of technical journalism and community building. Its activities are designed to bridge the gap between complex R&D breakthroughs and practical industry implementation. The entity?s work is categorized into several key areas:

1. Technical Content and Media Production

The company produces a vast library of technical content that explores the "how-to" and "why" of advanced packaging. This includes deep dives into Through-Silicon Vias (TSVs), hybrid bonding, chiplets, and fan-out panel-level packaging (FOPLP). The content is aimed at helping the industry move beyond Moore?s Law by focusing on vertical stacking and multi-die integration.

2. The 3D InCites Community

Unlike traditional news outlets, 3D InCites functions as a community-driven platform. It hosts a membership-based ecosystem where member companies?ranging from global equipment manufacturers like Lam Research and Applied Materials to material suppliers like Indium Corporation?share their latest product releases and facility expansions through "Member Highlights."

3. Industry Advocacy and Education

The entity acts as a vocal advocate for the advancement of the packaging workforce. It focuses on highlighting the contributions of women in STEM and provides resources for students looking to enter the microelectronics field. This includes the administration of the 3D InCites Scholarship through the IMAPS Microelectronics Foundation.

Products and Services

3D InCites offers a suite of digital media products and professional services tailored to the semiconductor supply chain.

The 3D InCites Podcast

A cornerstone of the brand, this podcast provides a forum for critical discussions on market trends, marketing strategies, and technical challenges. Episodes often feature live recordings from major industry events such as SEMICON West, ECTC, and the IMAPS Symposium. Topics range from chemical metrology for electroplating to the logistics of moving multi-million dollar semiconductor tools across global borders.

The 3D InCites Yearbook

This annual publication serves as a definitive record of the year's progress in 3D integration and advanced packaging. It features contributed articles from industry experts, market analysis, and a directory of the 3D InCites community. The yearbook is widely regarded as a reference manual for engineers looking for the latest in interconnect technology.

3D InCites Awards

Annually, the company hosts an awards program that recognizes technology enablement, manufacturing excellence, and sustainability. These awards are highly coveted in the microelectronics space, with categories such as: * Technology Enablement: Recognizing tools or software that solve critical 3D IC design bottlenecks. * Sustainability: Honoring companies that reduce the ecological impact of the IC value chain. * Best Place to Work: Highlighting corporate cultures that foster innovation and inclusivity.

Webinars and Virtual Events

3D InCites moderates and hosts technical webinars that bring together panels of experts to discuss emerging trends like Co-Packaged Optics (CPO) and the integration of AI into manufacturing environments. These sessions allow for real-time interaction between technology providers and end-users.

Branding and Marketing Services

For its member companies, 3D InCites provides specialized marketing services, including: * Content Marketing: Assistance in developing white papers, blog posts, and technical articles. * Event Coverage: On-site video interviews and booth highlights during major trade shows. * Sponsorship Opportunities: Strategic placement within the podcast and yearbook to reach a highly targeted audience of packaging professionals.

Key Technology Focus Areas

The services and products offered by 3D InCites specifically target the following technological domains: * Heterogeneous Integration: Combining different types of chips (e.g., logic, memory, and analog) into a single package. * Chiplet Ecosystems: Standardizing die-to-die interconnects to allow for modular chip design. * Thermal Management: Solutions for heat dissipation in high-density 3D stacks. * Advanced Materials: Innovations in underfills, thermal interface materials, and substrates.