Core Product Line: The TYTAN Furnace Systems

The flagship product line of Tystar Corporation is the TYTAN series of horizontal diffusion and LPCVD (Low Pressure Chemical Vapor Deposition) furnaces. These systems are engineered to handle a wide range of wafer sizes and processing requirements.

TYTAN 7000 Series

The TYTAN 7000 is designed for high-volume production environments. It features automated loading systems and multi-tube configurations that allow for the simultaneous processing of different recipes. The system is optimized for throughput while maintaining the high thermal stability required for advanced semiconductor nodes.

TYTAN 8000 Series

The TYTAN 8000 is specifically tailored for research and development as well as small-to-medium scale production. Its modular design allows for significant flexibility, enabling users to switch between different processing gases and temperature profiles with minimal downtime. It is a staple in university cleanrooms due to its reliability and ease of use.

TYTAN 9000 Series

This series is built for large-diameter wafers, including 200mm and 300mm applications. It incorporates advanced heating element technology to ensure that thermal gradients are minimized across larger surface areas, which is critical for maintaining yield in modern device manufacturing.

Chemical Vapor Deposition (LPCVD) Services and Solutions

Tystar is a world leader in Low Pressure Chemical Vapor Deposition. Their systems are capable of depositing a variety of high-quality thin films essential for semiconductor device architecture. Key deposition processes supported by Tystar include:

• Polysilicon Deposition: Used for gate electrodes and interconnects. Tystar systems provide exceptional grain size control and thickness uniformity.
• Silicon Nitride (Si3N4): Vital for passivation layers and etch masks. Tystar offers both stoichiometric and low-stress nitride deposition options.
• Silicon Dioxide (SiO2): Utilizing LTO (Low Temperature Oxide), HTO (High Temperature Oxide), and TEOS (Tetraethyl Orthosilicate) precursors to create dielectric layers with high breakdown voltages.
• SIPOS (Semi-Insulating Polycrystalline Silicon): Used for specialized power device applications to improve voltage stability.

Specialized Photochemical Vapor Deposition (Photo-CVD)

One of Tystar's most unique offerings is their Photochemical Vapor Deposition system. Unlike traditional CVD which relies on high temperatures to initiate chemical reactions, Photo-CVD uses ultraviolet (UV) light to dissociate precursor gases. This allow for the deposition of high-quality films at significantly lower temperatures (as low as 50 degrees Celsius). This technology is indispensable for processing heat-sensitive substrates, such as compound semiconductors, polymers, and organic electronics, where traditional thermal budgets would damage the device.

Diffusion and Oxidation Capabilities

Beyond deposition, Tystar systems are industry standards for traditional thermal processing:

• Atmospheric Oxidation: Providing both dry and wet (steam) oxidation for the growth of high-quality gate oxides and field oxides.
• Dopant Diffusion: Systems configured for Boron, Phosphorus, and Arsenic liquid or solid source diffusion to create P-N junctions and modify electrical conductivity in silicon wafers.
• Annealing: Precise thermal cycles for crystal damage repair following ion implantation and for silicide formation.

The Tystar Integrated Control System (TICS)

A critical component of Tystarâ??s hardware is their proprietary Tystar Integrated Control System (TICS). This software and hardware suite provides a comprehensive interface for furnace management. Key features include:

• Recipe Management: Users can program complex multi-step thermal and gas flow sequences.
• Real-time Monitoring: TICS provides live data logging of temperature, pressure, and gas flow rates, ensuring that every batch meets strict quality control parameters.
• Safety Interlocks: The system includes sophisticated safety protocols to manage hazardous gases and high-voltage components, protecting both the operator and the equipment.
• Data Integration: TICS is designed to interface with factory-level MES (Manufacturing Execution Systems) for automated data collection and lot tracking.

Support, Retrofitting, and Maintenance Services

Tystar Corporation provides extensive aftermarket support to ensure the longevity of their systems. Their service portfolio includes:

• System Retrofits: Tystar offers upgrade packages for older furnace models (including those from other manufacturers), replacing legacy controllers with modern TICS units and upgrading gas delivery systems to meet current safety standards.
• Process Development: The company maintains an application laboratory where they assist customers in developing new recipes and optimizing existing processes for specific material requirements.
• Maintenance and Parts: Tystar stocks a wide range of replacement parts, including quartzware, heating elements, mass flow controllers, and vacuum pumps, providing rapid response to minimize downtime in production environments.

Market Applications and Impact

The versatility of Tystar's equipment makes it essential across various sectors:

• MEMS: For creating the structural and sacrificial layers in sensors, actuators, and micro-mirrors.
• Power Electronics: Processing Silicon Carbide (SiC) and Gallium Nitride (GaN) devices that require high-temperature annealing and oxidation.
• Nanotechnology: Enabling the growth of carbon nanotubes and nanowires through specialized CVD processes.
• Photovoltaics: High-throughput diffusion for solar cell junction formation.

By combining deep metallurgical and chemical expertise with precision engineering, Tystar Corporation remains a cornerstone of the semiconductor equipment landscape, enabling the next generation of electronic and micro-mechanical devices.