Aehr Test Systems: Semiconductor Test and Reliability Solutions
Aehr Test Systems is a leading provider of advanced, high-performance test and burn-in equipment for the global semiconductor industry. Headquartered in Fremont, California, the company specializes in developing innovative solutions designed to ensure the quality, reliability, safety, and security of a wide range of integrated circuits and semiconductor devices. Aehr's primary business revolves around reliability screening, commonly known as "burn-in," for logic and memory integrated circuits, sensors, and optical devices, which is a critical process in semiconductor manufacturing to weed out early-life failures.
The core function of Aehr's systems is to stabilize and screen devices under controlled electrical and thermal stress conditions, which is essential for components used in high-reliability applications. The growing demand for robust semiconductors in markets like electric vehicles (EVs), EV charging infrastructure, solar and wind power, 5G communications, advanced computing, and Artificial Intelligence (AI) processors has driven the need for Aehr's specialized test solutions. Their technology supports testing at three main levels of the manufacturing process: full wafer-level, singulated bare die, and packaged parts.
Products and Services
Aehr Test Systems' product portfolio is organized into scalable platforms and various carriers and contactors that enable high-volume, cost-effective parallel testing. The key offerings include:
FOX-P Family of Test Systems
The FOX-P family represents the company's flagship line of Wafer-Level, Singulated Die, and Module Test and Burn-in Systems. These systems are known for their high parallelism, meaning they can test and burn-in thousands of devices simultaneously, offering a significant throughput advantage for high-volume production.
FOX-XP System: This is the high-volume production version of the platform, capable of performing full wafer contact test and burn-in for a broad array of devices. It is particularly well-suited for high-reliability components, including Silicon Carbide (SiC) and Gallium Nitride (GaN) power semiconductors, which are vital components in electric vehicle power trains and other power management applications. It also tests 2D and 3D sensors, memory semiconductors, microcontrollers, and photonics/integrated optical devices.
FOX-NP System: Tailored for engineering, qualification, and lower-volume production applications, the FOX-NP offers flexibility and scalability for initial product development and ramp-up.
FOX-CP System: A more compact, low-cost single-wafer solution designed for test and reliability screening of logic, memory, and photonic devices.
Contactor and Carrier Solutions
To facilitate the connection between the system and the devices under test, Aehr offers specialized interfaces:
FOX WaferPak Contactor: This proprietary, reusable full-wafer contactor is capable of testing full wafers up to 300mm in diameter directly on the FOX-P systems. It enables Integrated Circuit (IC) manufacturers to perform test, burn-in, and stabilization on the entire wafer before it is diced, which is critical for identifying defects early.
FOX DiePak Carrier: This is a reusable package that allows for the testing, burning-in, and stabilization of singulated bare die, resulting in "Known-Good Die" (KGD). KGD are essential for multi-chip modules and advanced packaging where defective dies would render the entire high-value assembly unusable. The product line also includes the FOX DiePak Loader, a tool to automate the process.
Packaged Part Test Systems
Aehr also provides solutions for the final test and burn-in of packaged semiconductor devices, a portfolio expanded through the acquisition of Incal Technology, Inc.
MAX and ABTS Systems: The MAX and Advanced Burn-in and Test Systems (ABTS) are designed to burn-in both high-power and low-power packaged logic devices, including microprocessors, Digital Signal Processors (DSPs), memory, and System LSI.
Sonoma Family of Test Solutions: Acquired as part of the strategy to penetrate the high-power test market, this family of solutions provides ultra-high-power packaged part reliability and burn-in test capabilities for advanced AI accelerators, Graphics Processing Units (GPUs), and High-Performance Computing (HPC) processors, positioning Aehr as a turnkey provider in the rapidly growing AI market segment.
Through this combination of highly parallel systems, proprietary contact technology, and packaged part solutions, Aehr Test Systems provides comprehensive semiconductor reliability screening, spanning from engineering evaluation to high-volume production.
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