Corporate Structure and History

• Official Name: NAURA Technology Group Co., Ltd. (北方华创科技集团股份有限公司)
• Headquarters: Beijing, People's Republic of China
• Founding Year: September 2001 (Restructured under current name in February 2017)
• Stock Exchange Listing: Shenzhen Stock Exchange (SZSE: 002371)
• Primary Operating Subsidiaries: Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing NAURA Magnetoelectric Technology, among others.

Historical Context

The history of NAURA stems from two foundational state-backed electronic technology enterprises established in 2001: 1. Beijing Sevenstar Electronics Co., Ltd.: Focused on precision electronic components, gas flow measurement tools, and thermal equipment. Sevenstar completed its initial public offering on the Shenzhen Stock Exchange in 2010. 2. Beijing North Microelectronics Co., Ltd. (NMC): Specialised in advanced semiconductor process tools, particularly plasma etching and Physical Vapor Deposition (PVD) equipment.

In 2016–2017, Sevenstar Electronics acquired NMC in a major strategic restructuring, consolidating their technological portfolios, research talent, and manufacturing capabilities into NAURA Technology Group. Since then, NAURA has grown into a primary equipment supplier for domestic Chinese semiconductor fabrication plants (fabs) and global markets.

Core Business Segments, Products, and Services

NAURA operates primarily through three main business groups: Semiconductor Equipment, Vacuum & New Energy Equipment, and Precision Components.

1. Semiconductor Process Equipment

Through its subsidiary NAURA Microelectronics, the company manufactures front-end and back-end semiconductor equipment used in wafer fabrication, 3D integration, advanced packaging, micro-electromechanical systems (MEMS), and compound semiconductor production.

• Etching Systems:
  • Inductively Coupled Plasma (ICP) Etchers: Used for silicon etching, deep reactive ion etching (DRIE), dielectric etching, and metal etching in logic and memory chip manufacturing.
  • Reactive Ion Etchers (RIE): Designed for precise pattern transfer in compound semiconductors (SiC, GaN, GaAs) and power IC fabrication lines.
• Thin Film Deposition Systems:
  • Physical Vapor Deposition (PVD): Metal interconnect deposition, barrier layer sputtering, and contact metal deposition systems.
  • Chemical Vapor Deposition (CVD): Plasma-Enhanced CVD (PECVD) and Low-Pressure CVD (LPCVD) tools for insulator, dielectric, and polysilicon layer growth.
  • Atomic Layer Deposition (ALD): Ultra-thin conformal film deposition tools for advanced node semiconductor fabrication.
• Thermal Processing and Furnace Systems:
  • Oxidation and Diffusion Furnaces: Vertical and horizontal thermal processing systems for gate oxidation, dopant drive-in, and annealing.
  • Rapid Thermal Processing (RTP) Systems: High-temperature rapid annealing equipment used in lattice repair and silicide formation.
• Wet Cleaning and Surface Treatment Equipment:
  • Single-Wafer Wet Cleaning Tools: High-precision single-wafer chemical and ultrasonic cleaning systems designed to remove particles and residues.
  • Batch Wet Processing Stations: Multi-wafer immersion and spray cleaning, etching, and drying systems for substrate preparation.
• Specialized Semiconductor Tools:
  • Coating and developing equipment, wafer bonding tools, and ion implantation support systems.

2. Vacuum and New Energy Equipment

NAURA leverages its high-vacuum, thermal, and material science engineering capabilities to produce machinery for energy production, energy storage, and industrial vacuum applications.

• Crystal Growth Systems:
  • Monocrystalline silicon pulling furnaces and compound semiconductor crystal growth equipment used in solar wafer and semiconductor ingot manufacturing.
• Vacuum Heat Treatment Equipment:
  • Vacuum annealing, brazing, quenching, and sintering furnaces for advanced metallurgy, aerospace alloys, and magnetic material production.
• Vacuum Coating Equipment:
  • Magnetron sputtering coating systems, multi-arc ion plating machines, and continuous coating lines for fuel cell metal bipolar plates, decorative finishes, and functional optical films.
• Lithium-Ion Battery Manufacturing Equipment:
  • Slurry coating systems, high-efficiency vacuum drying ovens, and automated cell assembly process lines used by battery cell manufacturers for electric vehicles (EVs) and stationary energy storage systems.

3. Precision Electronic Components

NAURA supplies high-reliability electronic components and control modules designed for harsh operational environments, industrial automation, and high-precision measurement.

• Mass Flow Controllers (MFC) & Meters:
  • High-accuracy gas flow measurement and control devices critical for semiconductor process chambers, chemical processing, and analytical equipment.
• Passive Components:
  • Precision resistors, high-voltage ceramic capacitors, ultra-stable quartz crystal devices, inductors, and pulse transformers.
• Active Components & Sensors:
  • Analog integrated circuits, modular DC-DC power supplies, microwave components, and quartz micro-electromechanical (MEMS) sensors.
• Magnetic Materials:
  • Soft magnetic ferrites, permanent magnet products, and high-performance core materials for power conversion systems.

4. Technical Support and After-Sales Services

To support capital-intensive semiconductor fabs and automated factories, NAURA provides a comprehensive suite of professional services:

• Field Engineering and Maintenance: On-site tool installation, calibration, preventive maintenance, and rapid-response field repairs.
• Spare Parts Management: Supply chain logistics for replacement components, process consumables, and spare modules.
• Retrofits and Upgrades: Custom hardware and software modification kits designed to extend the operating lifespan of legacy toolsets or adapt existing lines to new process recipes.
• Process Tuning and Yield Optimization: On-site process engineering consultation to optimize wafer throughput, uniform film deposition, and chip yield.

Target Markets and Industry Applications

NAURA’s products serve a broad spectrum of high-technology sectors:

1. Integrated Circuit (IC) Manufacturing: Logic, DRAM, 3NAND Flash memory, and specialty analog/mixed-signal chip manufacturing lines.
2. Compound Semiconductors: Silicon Carbide (SiC) and Gallium Nitride (GaN) power electronics used in electric vehicles, fast chargers, and renewable energy inverters.
3. Advanced Packaging & 3D Integration: Through-Silicon Via (TSV), fan-out wafer-level packaging (FOWLP), and chiplet interconnect manufacturing processes.
4. Photovoltaics & Renewable Energy: Solar ingot pulling, cell deposition, and clean energy storage manufacturing infrastructure.
5. Industrial Automation & Smart Grid: High-reliability sensors, components, and power distribution electronics.

Operational Scale and Global Presence

NAURA operates multiple major R&D and manufacturing bases in China, primarily concentrated in Beijing's Economic-Technological Development Area (BDA). The company employs over 20,000 personnel, with a significant percentage dedicated to research and development.

While its primary market focus remains domestic China—where it acts as a critical vendor for local semiconductor foundries—NAURA maintains international customer service networks, field service offices, and sales points across Asia, Europe, and North America.