Company Profile
Jet Process Corporation
Profile date: 2025-01-19
Jet Process Corporation: Thin Film Deposition and Advanced Materials
Jet Process Corporation (JPC) is a privately held United States-based technology company, founded in 1991, that specializes in the field of advanced thin film deposition. The company's core value proposition lies in its ownership and sole development of a breakthrough proprietary technology known as Jet Vapor Deposition (JVD). JPC holds more than 30 U.S. and foreign patents covering its unique JVD technology, which represents a significant advancement over conventional thin film coating methods.
What the Company Does: The Jet Vapor Deposition (JVD) Process
Jet Process Corporation primarily functions as a high-tech coating service provider, utilizing its patented Jet Vapor Deposition (JVD) process for development, prototyping, and production applications. The JVD process is an innovative, environmentally sound, and high-rate physical vapor deposition technique that offers numerous competitive advantages for making high-quality thin film metal, dielectric, and other coatings.
Key Features and Advantages of JVD Technology: * Low-Temperature Operation: JVD operates under low-temperature and low-vacuum conditions, making it compatible with heat-sensitive substrates, photoresist patterns, and mask materials that might outgas under conventional high-temperature/high-vacuum processes. * Environmental Soundness: The process is recognized for being clean and environmentally friendly, as it is a carbon-free dry process that does not employ toxic precursors or effluents, offering a superior alternative to methods like electroplating, which uses toxic chemicals and generates process waste. * Versatile Deposition: The JVD process vaporizes source material (typically metal wire) completely into atoms, which are then carried by sonic inert gas jets to the substrate for deposition. This method enables the high-rate deposition of a wide variety of elemental or multi-component materials, allowing for a reproducible combination of complex layers and alloys. * Nanocluster Deposition: The technology is capable of depositing materials in either atomic or nanocluster form. The ability to deposit metal nanoclusters is particularly advantageous for creating ultra-small solder bumps on substrates with high-density requirements.
Products and Services
Jet Process Corporation focuses its business model on providing JVD thin film coating services and products for advanced applications across numerous high-tech industries.
1. Thin Film Coating Services: The core service is the application of advanced thin film coatings with rapid turnaround times for contract Research & Development (R&D) and production volume runs. These services are the primary revenue stream and application for the JVD technology.
2. Specialized Solder Coatings: JPC is a specialist in thin film solder coatings for microelectronics and optoelectronics packaging. The company???s services focus heavily on lead-free solders to maintain strict adherence to Restriction of Hazardous Substances (RoHS) standards. * Gold-Tin (AuSn) Alloys: Deposition of eutectic and off-eutectic gold-tin solders, including common compositions like AuSn 80/20, 78/22, 75/25, and 73/27. These solders are critical for demanding, high-reliability applications. * Other Lead-Free Solders: Deposition of alloys from the Tin-Silver-Copper (SAC) family (e.g., SAC 387, SAC 305), as well as SnIn, SnAg, SnAgSb, SnInAg, and SnCuAg. * Solder Bumps: JVD enables the manufacture of small, high-density solder bumps, with the capability of producing bumps as small as 3 microns in diameter, which is essential for advanced semiconductor packaging.
3. Adhesion and Diffusion Barrier Layers: To ensure high-quality and reliable solder joints, JPC deposits essential ancillary layers that promote adhesion and prevent the diffusion of materials. These typically include: * Titanium-Platinum-Gold (TiPtAu) * Titanium-Nickel-Gold (TiNiAu) * Chromium-Platinum-Gold (CrPtAu)
4. Advanced and Dielectric Films: Beyond solders, the JVD process is versatile enough to deposit other related materials in elemental form (e.g., Gold, Silver, Tin, Nickel, Chromium) and, in a reactive mode with oxygen or nitrogen, can create complex oxide and nitride dielectric films that are often not achievable through other thin film methods.
5. Custom R&D Equipment: In addition to its coating service, Jet Process Corporation builds custom JVD R&D coating equipment for clients who wish to integrate the technology into their own research and development facilities.
Target Applications and Markets
The high quality and reliability of JVD coatings make Jet Process Corporation a key supplier for products in demanding, high-technology sectors. The primary markets and applications served include: * Micro- and Opto-Electronics: Semiconductor packaging, interconnects, and components where ultra-small, high-reliability solder joints are necessary. * Solid State Lighting: Thin film coatings for advanced lighting components. * Sensors and MEMS: Advanced sensors and Micro-Electro-Mechanical Systems components requiring precise coating and bonding. * Photonics and Telecommunications: Devices such as optical devices, RF, and microwave components, where clean and accurate metallization is paramount. * Aerospace and Defense: As an ITAR-registered company, JPC is a manufacturing partner for products subject to U.S. defense regulations. * Medical and Thermal Management: Applications in medical devices and complex thermal management systems that rely on durable and functional thin films.