Core Technology: In-Chip Microfluidic Cooling

The fundamental innovation of Corintis lies in its shift from traditional "top-down" cooling to "in-chip" cooling. Traditional cooling relies on bulky copper cold plates or heat sinks that are separated from the actual silicon heat source by multiple layers of materials (TIMs, lids, and substrates). Corintis removes these thermal barriers by etching microscopic channels directly into the silicon or bringing the liquid coolant into direct contact with the silicon die.

• Microfluidic Channels: The technology utilizes a network of channels as small as 10 micrometers (smaller than a human hair). These channels are precisely patterned to follow the specific "heat map" of a chip, ensuring that liquid coolant reaches the most critical hot spots.
• Co-Design of Logic and Fluidics: Corintis advocates for a "co-design" approach where the semiconductor?s logical architecture and its thermal management system are designed simultaneously. This allows for 3D-stacked chip architectures that were previously impossible due to internal heat accumulation.
• Low Water Consumption: Because the cooling is extremely targeted and efficient, the system requires significantly lower flow rates and less water than traditional liquid cooling systems.

Product Portfolio

Corintis provides an integrated ecosystem of software, hardware, and validation tools to support chip designers and data center operators.

1. Glacierware? (Design and Optimization Software)

Glacierware is an AI-powered simulation and optimization platform tailored for high-performance liquid cooling. * AI-Accelerated CFD: The software uses proprietary machine learning algorithms to perform ultra-fast Computational Fluid Dynamics (CFD) simulations, allowing engineers to iterate on complex microfluidic designs in minutes rather than days. * Topology Optimization: It automatically generates optimized cooling patterns based on the specific power map of an Integrated Circuit (IC), mimicking organic structures like leaf veins to maximize heat dissipation. * Manufacturing Integration: Glacierware ensures that the generated designs are compatible with high-volume semiconductor manufacturing processes.

2. Therminator? (Thermal Testing and Validation)

The Therminator is a fully integrated thermal emulation system designed to accelerate the testing and validation of cooling solutions before a chip is even fabricated. * Thermal Test Vehicle (TTV): The system hosts a custom TTV that replicates the exact thermal behavior and power distribution of data center GPUs and CPUs. * Real-Time Data Acquisition: It features 221 integrated temperature sensors and supports up to 2,000 Watts of total power capacity, providing spatially resolved temperature readouts in real-time. * Risk Mitigation: By validating thermal systems using the Therminator, engineers can calibrate measurement tools and evaluate Thermal Interface Material (TIM) stability under realistic, programmable load conditions.

3. Microfluidic Cold Plates and Packaging

Corintis manufactures high-performance cold plates that serve as drop-in replacements for existing liquid cooling systems or as integrated "co-packaged" components. * Silicon and Copper Microfluidics: The company operates a dedicated manufacturing facility capable of producing cold plates with micro-scale features in high volume. * Custom Packaging Solutions: Corintis offers specialized packaging that includes the fluidic manifold and leak-proof seals required to deliver coolant directly to the IC die.

Services and Manufacturing Capabilities

Corintis operates a vertically integrated business model that spans from initial R&D to mass production.

• Co-packaged Cooling Integration: Corintis works with semiconductor manufacturers to integrate microchannels directly into the silicon manufacturing process, enabling "in-chip" cooling for flagship AI accelerators.
• Prototyping and Thermal Mapping: The company provides services to map the thermal hot spots of existing chips and design custom cooling retrofits that can triple the heat removal efficiency of current server hardware.
• High-Volume Manufacturing: As of 2026, Corintis is scaling its production capabilities with a target of manufacturing over one million microfluidic cold plates annually to meet the surging demand for AI infrastructure.

Strategic Partnerships and Market Impact

The Microsoft Collaboration

In late 2025, Corintis and Microsoft announced a landmark breakthrough in chip cooling. By collaborating on a prototype that utilized Corintis? AI-optimized microfluidic channels, Microsoft was able to cool a server running core services three times more effectively than with state-of-the-art cold plates. This collaboration demonstrated that microfluidics can significantly reduce silicon peak temperatures (by up to 65%), allowing for higher burst performance and "overclocking" in data centers.

Sustainability and Efficiency

Data centers currently account for a significant portion of global electricity consumption, with cooling representing up to 30-40% of that total. Corintis? technology addresses this environmental challenge by: * Reducing Energy Waste: Higher thermal efficiency means smaller pumps and lower energy requirements for the cooling infrastructure. * Enabling Higher Density: By cooling chips more effectively, data centers can pack more compute power into the same physical footprint, reducing the need for new building construction.

Growth and Corporate Leadership

Following a successful $24 million Series A funding round in 2025?led by BlueYard Capital with participation from Walden International?Corintis has expanded its leadership team with industry veterans. Notable board members include Lip-Bu Tan (former CEO of Cadence and Intel board member) and Geoff Lyon (founder of CoolIT), bringing decades of experience in semiconductor and liquid cooling markets.