Zen Voce Corporation (TPEx: 3581) is a specialized high-technology manufacturer and engineering solutions provider operating in the global semiconductor, optoelectronics, micro-electro-mechanical systems (MEMS), and flat-panel display industries. Established in April 1999 and headquartered in Hsinchu County, Taiwan, the company designs, develops, manufactures, and services precision equipment, test fixtures, and process integration solutions.
While Zen Voce operates international sales and technical support channels serving customers across key semiconductor markets—including the United States, China, Singapore, and Europe—its primary engineering and manufacturing facilities are based in Taiwan. Zen Voce bridges front-end semiconductor processing and back-end assembly/test operations by offering proprietary dicing and ball-mounting machinery alongside customized test interfaces and agency distribution for advanced testing hardware.
2. Core Business Areas & Capabilities
Zen Voce operates through two primary operational divisions complemented by distribution and agency services:
Equipment Design and Manufacturing Division: Focuses on precision mechanical and optical automation machinery used for wafer cutting, substrate singulation, ball grid array (BGA) solder ball placement, and post-cut substrate cleaning.
IC Testing & Fixture Division: Focuses on custom test hardware, electrical interface boards, high-frequency test sockets, and mechanical change kits used across wafer sort, final test, and burn-in testing stages.
Agency & System Integration Services: Acts as an authorized distributor and integration partner for specialized burn-in test connectors, MEMS manufacturing systems, solar processing tools, and LCD inspection equipment.
3. Detailed Product & Service Portfolio
A. Equipment & Automation Products
Zen Voce develops standard and customized automated machinery tailored to high-precision manufacturing requirements:
Wafer Dicing Systems: Precision single-spindle and high-throughput dual-spindle cutting machines engineered for semiconductor wafers, compound semiconductor substrates (e.g., GaN, SiC), and LED wafers up to 12 inches (300 mm).
Package Dicing & Singulation Machines: Fully automatic singulation saws designed for diced substrates, molded strip packages, QFN/DFN packages, and integrated circuit boards.
Wafer and Board Cleaning Systems: High-pressure micro-cleaning, spin rinsing, and drying systems integrated directly with dicing saws or operating as standalone cleaning units to eliminate particulate contamination post-cut.
The company provides electrical and mechanical test consumables and interface hardware critical for semiconductor quality assurance:
Probe Card Motherboards & PCBs: Custom multi-layer printed circuit boards designed to bridge automatic test equipment (ATE) test heads with micro-probe interfaces for wafer-level testing.
IC Test Change Kits: Mechanical conversion kits and docking hardware that adapt automated IC handlers to accommodate different chip packaging form factors during high-volume production testing.
High-Fix (HIFIX) Interface Solutions: Signal-integrity-optimized test fixtures linking ATE tester channels directly to device-under-test (DUT) boards.
Test Sockets & Load Boards: High-frequency, low-inductance test sockets and load boards engineered for logic, memory, and mixed-signal integrated circuit validation.
Burn-In Sockets & Connectors: Thermal- and electrical-stress-rated sockets and interconnect components for extended reliability and early-failure screening under elevated temperatures.
C. Technical & Engineering Services
Process Integration & Customization: Custom fixture design and process parameter tuning for advanced packaging assembly lines.
Equipment Maintenance & Overhaul: Field maintenance, spindle refurbishment, optical calibration, and software upgrade services for installed toolsets.
